E-Fab & TPC

E-Fab: 1075 Richard Avenue, Santa Clara, CA 95050 | www.e-fab.com

E-Fab Building Sign

Thin Metal & Flex Circuit Products

E-Fab, Inc. was established in 1982 in the heart of Silicon Valley. Equipped with a wide range of precision manufacturing capabilities - including photochemical fabrication, photoetching, and microchemical milling - they produce thin metal and flex circuit products for customers across a diverse set of industries around the world. They believe all ideas are good ideas, and none are too small.

E-Fab manufactures parts from thin metal sheets of alloys including, Aluminum, Copper, and Titanium; they also work with flex substrates, advanced PCB materials, and high-frequency laminates. These parts are used in simple to complex applications by high-tech OEMs on the leading edge of new products and designs.

The E-Fab team has over 100 years of combined experience in manufacturing engineering and manufacturing services. Some of the industries served include aerospace, electronics, medical instrumentation and implant, defense, and semiconductors. Whether the design is complete and dimensioned, or only a concept, the E-Fab team is ready to discuss your project.

E-Fab Company Highlights

Products - Small Precision Parts

Stiffeners & Busbars: Customizable pins, spacing, height and length, surface holes or slots, top and end tabs

Mesh Screens: Simple Filters, Sieves, PCB Ventilated Shields, EMI and RFI Shields, Particle Filters. Hexagonal or Round Screen Mesh  

Micro Bumps: Formed protrusions also called Micro Divets. Miniature Switch Contacts, IC Test Socket Contacts, Formed Spring Contacts, Electrically Isolated Test Pins 

Microwave & RF Circuits: Flex Circuits, Sculptured Flex Circuits, PCB Flex Circuits, Heavy Metal Flex Circuits

Custom Etched Parts: Antennas, Carriers, Contacts, Encoders, Gaskets, Leadframes, Shields, Shims, Step Lids, Surgical Blades, Washers

Capabilities

Metal Etching

  • Photochemical machining (PCM) is often a low cost, more precise method than laser etching
  • Part thicknesses ≤ 0.060 inches
  • 1-2 day turnaround

Dielectric Coatings

  • Interference Coatings on Sheet Metal
  • Approximately 0.003” Coating Thickness
  • 12" x 8" panels, larger available based on design

Additional Service Capabilities

  • Press Forming and Roll Forming
  • Heat Pressure Bonding
  • Electroplating, Barrel Plating, and Rack Plating

Materials Processed: Aluminum, Beryllium Copper, Copper and Brass Alloys, Inconel, Nitinol, Nickel Alloys, High-Frequency Laminates

Industries Served

Aerospace & Defense

Semiconductor

Electronics

Medical Instruments & Implants

Microwave & RF Circuits

Accreditations

ISO 9001:2015 Certified

ITAR Registered